RoHS Directive | RoHS Standard RoHS指令|符合RoHS标准

The Restriction of Hazardous Substances Directive ( RoHS ) 2002/95/EC was adopted in February 2003 by the European Union. 有害物质限制指令（ RoHS ）于2002/95获得通过，在2003年2月由欧洲联盟。

RoHS is often referred to as the "lead-free" directive. 产品往往是被称为“铅免费”的指令。
The RoHS directive took effect on July 1, 2006, but is not a law; it is simply a directive. RoHS指令生效， 2006年7月1日，但不是一个法律;这只不过是一项指令。

It is closely linked with the Waste Electrical and Electronic Equipment Directive ( WEEE ) 2002/96/EC which sets collection, recycling and recovery targets for electrical goods and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste. 这是紧密联系在一起的废物电器及电子设备指令（ WEEE指令） 2002/96/ec列出收集，回收和回收的目标，电器用品，是一个组成部分的立法倡议，以解决问题的巨额有毒电子废物。

The RoHS WEEE compliance directive places the responsibility of compliance on the "producer" of the equipment. This RoHS Directive is part of an ever-increasing push for more environmentally sound manufacturing procedures as demand for electrical and electronic goods rises. RoHS法令WEEE指令遵守 指示地方的责任，遵守对“生产者”的设备， 这RoHS指令的一部分，不断增加的推动更多的无害环境的制造程序的需求，电器及电子消费品上升。

RoHS will have significant impact - on a global scale - with manufacturers being prohibited from placing products on the market that contain banned substances. 产品将有重大的影响-在全球范围内-与制造商被禁止将产品投放市场含有违禁物质。

Sample RoHS Compliance Statement | RoHS Testing | RoHS Banned Substances 样本RoHS符合性声明 | 产品测试 | 产品违禁物质

RoHS restricts the use of the following 6 substances: RoHS指令限制使用以下6物质：

• Lead 领导
• Mercury 汞
• Cadmium 镉
• Chromium VI 铬VI
• PBB 多溴联苯
• PBDE PBDE ，

PBB and PBDE are flame retardants used in some plastics. 与PBDE ，多溴联苯是阻燃剂中使用的一些塑料。

RoHS Criticism RoHS的批评

Restricting lead content in solders for electronics requires expensive retooling of the assembly lines and different coatings for the leads of the electronic parts. 限制铅含量的焊料为电子，需要昂贵的重组的装配生产线和不同涂料的线索的电子零件。 The alternatives to the solders typically have higher melting points (up to 260 °C, instead of just 215 °C), requiring different materials for chip packagings and for some circuit boards; the overheating may also affect reliability of some semiconductors. 替代向焊料通常有较高的熔点（高达260 ° C时，而不是只215 ° C时） ，要求不同材料芯片容器和一些电路板的;过热，也可能影响可靠性的一些半导体。

The alternative solders are also harder, resulting in slow development of cracks (instead of plastic deformation, as the softer Sn-Pb solder does) because of thermal expansion and contraction as some parts heat up and cool down during operation, thus significantly impairing long-term reliability and device lifetime. 替代焊料，也更难，导致在发展缓慢的裂缝（而不是塑性变形，由于软，锡铅焊料是否）由于热膨胀和收缩部分地区升温和降温过程中的运作，从而大大损害长期任期的可靠性和设备的寿命。 Some countries therefore tend to exempt medical and telecommunication infrastructure products from the legislation. 因此，一些国家往往以豁免医疗和电信基础设施产品，从立法。

Translate this RoHS Information: 翻译此产品信息：

RoHS - WEEE NEWS 产品-W EEE指令新闻